Technology

The Science of Downstream Radical Chemistry

Aggressive, direct plasma cleaning can sputter, overheat or etch sensitive components. Evactron® technology takes a radically different approach.

By generating a low-power RF plasma away from the main chamber, our systems create a gentle, localized stream of oxygen radicals. These radicals sweep through the vacuum environment, chemically converting solid hydrocarbons into harmless gas by-products (CO₂, H₂O, CO) that your existing vacuum pumps easily evacuate.

Why downstream plasma

No Sputtering Damage

Safe for delicate detectors (including most EDS) and apertures — neutral radicals carry no ion energy.

Universal Compatibility

Fits standard flange ports on leading analytical and imaging tools — electron microscopes, surface-science and synchrotron instruments.

Plug-and-Play Automation

Programmable cycles clean while you focus on everything else in the lab.

TECHNOLOGY

The Science of Downstream Radical Chemistry

Reactive radicals do the cleaning — ions never reach your sample.

Process gas in

Air or O₂ flows into the remote plasma source.

RF plasma

A hollow-cathode RF plasma is struck — away from your sample.

Reactive radicals

Neutral oxygen radicals stream downstream — no ions, no sputtering.

Carbon removed

Radicals convert hydrocarbons into CO₂ and H₂O.

Pumped away

Volatile by-products leave with the vacuum pump.

Downstream plasma vs. ozone cleaning

Removes hydrocarbon contamination

Sample / detector damage

Works under vacuum

Throughput

Operator safety

Ready to Restore Peak Performance?

Talk to our team about the right Evactron® system for your chamber.

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