Alternate Gas Configurations
The Evactron® E50 Alternate Gas Plasma Cleaner has two configurations: an ultrahigh-purity filter (3 nm pore size) version that meets the stringent SEMI F38-0699 requirements of the semiconductor industry, and a precision filter (0.5 µm pore size) version for general lab conditions. In-line filters prevent particulates from gas feedlines entering the plasma stream. Alternate gases tested include O₂, CDA, Ar/H₂, Ar/O₂, N₂/H₂ and N₂. The use of 100% H₂ is not recommended for safety reasons.
System Features
RF Power
75W peak, 50W continuous power output.
Fast Cleaning
Maximize instrument uptime and productivity
Dual Action Cleaning
Advanced cleaning using both plasma and UV afterglow.
Energy Efficient
Hollow cathode, capacitive coupled plasma (CCP) technology.
Pop Ignition
Patent-pending ignition technology at high vacuum.
Programmable & Smart Control
Set power, cleaning time, cycles and recipes via a custom remote or tethered touchpad.
Wide Pressure Range
Operation from 0.3 Pa (2 mTorr) to 80 Pa (600 mTorr).
Alternative Gases
Run a range of process gases to tailor the cleaning chemistry to your application.
External Interlock
Optional external interlock connection for safety.
TMP Compatible
No advance venting needed for operation.
Non-Damaging
Safe for sensitive components with no sputter etch.
Flexible Install
Can be installed on a variety of vacuum chambers or load lock.
Push Button Operation
Simple, automated cleaning initiation.
Autotune Ignition
No match or gas flow adjustments needed for plasma ignition.
Certified
RoHS, CE, NRTL, TUV and SEMI S2 compliant.
Ready to Restore Peak Performance?
Talk to our team about the right Evactron system for your chamber.