300 E Green St
Pasadena, CA 91101
USA
46th International Symposium for Testing and Failure Analysis (ISTFA)
At ISTFA, you can learn from the experts, network with people who can support your work, explore the latest apps and tools for the failure analysis lab, and become a knowable presenter yourself, teaching others. ISTFA offers opportunities for all levels of proficiency, from the Next Generation of engineers, who seek to boost their starting career, to expert engineers, who seek insight into Next Generation challenges already today.
The Rise of MEMS and 3D Failure Analysis
MEMS (Microelectromechanical Systems) sense physical phenomena and trigger action, and they have enabled a slew of useful, essential, and fun applications—the most common of which are found in smart phones, cars, printers, and wearables—but the application space keeps growing as costs decrease and new MEMS sensors are developed. Advances in packaging technologies, including wafer bonding, 3D (TSV/heterogeneous) integration, and die stacking have been essential in helping MEMS sensors proliferate. Where are MEMS going—new sensors, new applications, new fabrication and packaging processes? What challenges are created for failure analysis in packaging and new applications?
