Our hybrid meeting format provides two distinct options for attendees, one in Honolulu, Hawaii, May 8-13, 2022, for those comfortable with and able to travel, and one online May 23-25, 2022, for those who prefer a virtual meeting.
The Honolulu Experience (In Person) offers attendees a traditional MRS Meeting, including a full slate of symposium sessions, professional development events, award presentations, an interactive exhibit hall and in-person networking opportunities. Those who attend in person in Honolulu also will be able to participate in The Virtual Experience.
The Virtual Experience, held two weeks later, includes the same symposium topics, but with a separate selection of talks delivered via our virtual platform. All presentations, events, networking and exhibits will be available online only.
The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as “3-Beams,” is the premier gathering of scientists and engineers who are dedicated to electron, ion and photon lithography, imaging, and analysis; atomically precise fabrication; nanofabrication process technologies; related emerging technologies; and their applications in a broad spectrum of fields.
This is the 65th meeting of the EIPBN, where top researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent trends and future directions in these technologies.
The FLEX Conference & Exhibition is Co-locating with SEMICON West 2022
SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain, and the FLEX Conference & Exhibition, the annual event focused on flexible hybrid and printed electronics innovations, will co-locate at the Moscone Center in San Francisco, July 11-14, 2022. Registration for both events opens next spring.
In its 20th year, the FLEX Conference highlights innovations emerging from public-private partnerships formed by SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium), and SEMI-NextFlex. The latest advances in flexible and printed electronics, including applications that deepen interactions between users and their surroundings, will take center stage at the FLEX Conference 2022.
The event will feature:
Don’t miss out on the premier microscopy education and networking event of the year – Microscopy & Microanalysis 2022 in Portland, Oregon!
Portland provides an ideal summer backdrop for what promises to be another stellar M&M meeting! The Pacific Northwest region is a vacationer’s dream, with numerous activities for outdoor enthusiasts and urban adventurers alike. Tax-free shopping; countless local breweries, distilleries, and wineries; legendary Portland food carts and hundreds of restaurants with cuisine from all over the world; unparalleled hiking, camping, boating and sightseeing in the Cascade and Olympic National Parks, the picturesque Oregon Coast, and the stunning Columbia River Gorge.
Don’t miss out! Save the Date and plan to attend Microscopy & Microanalysis 2022with over 1200 platform and poster sessions, workshops, tutorials, and networking events, in addition to four days of the world’s largest Microscopy products and services commercial expo hall in the world.
ASM is the only society that unites different market segments that cross the entire materials world.
IMAT is the new ASM International annual meeting and, in keeping with our focus on membership needs, will offer an industry-focused conference and exposition targeting the advancement of materials, processes and their applications. Traditional materials topics of strong interest will be discussed, including metals, ceramics, composites, coatings, alloy development, microstructure/process/properties relationships, phase equilibria, mechanical behavior, joining, corrosion and failure analysis. In addition, a spectrum of emerging topics of global interest will be covered, such as: additive manufacturing, materials for the energy, power and transportation industries, renewable and sustainable materials & processes, materials to enable automation and robotics, digitization of the materials industry and biomedical/multifunctional materials.
Multiple student events and competitions will be offered to develop connections to the next generation of materials scientists.
The Materials Science & Technology (MS&T) technical meeting and exhibition is the long-standing, recognized forum for fostering technical innovation at the intersection of materials science, engineering, and application. Each year, MS&T brings together scientists, engineers, students, suppliers, and business leaders to discuss current research and technical applications and to shape the future of materials science and technology.
The event’s unmatched technical program addresses structure, properties, processing, and performance across the materials community. Its exhibition showcases a wide variety of equipment and services to the automotive, aerospace, instrumentation, medical, oilfield, and energy industries. MS&T is organized by a joint partnership of leading materials science-related societies. Visit the individual conference web pages for more information.
The NSH Convention forms the largest educational event of its kind working to advance and promote the histology profession. NSH is the premier source of learning, knowledge and future-oriented research for histology professionals. Attendance provides resources, education, ideas and advocacy to enhance the performance in the laboratory and ultimately the best patient care. The convention features dynamic learning formats including hands on Learning Labs, lecture style workshops and panels and focused training on a specific technique in the form of Express Talks.
The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new set of disruptive development in new structures and novel materials was introduced. Thus, defects causing semiconductor device failures have become smaller and more elusive. To chase such defects, all failure analysis techniques and methodologies also need to be improved to keep pace with semiconductor technology. Failure characterization, fault isolation, electrical failure analysis, physical analysis, microscope imaging and materials analysis are examples of the key challenged areas. A gap analysis has been done by the EDFAS FA Technology Roadmap Committee and is available on ASM connect. To close the gap, you can play a role, no matter what your area of expertise is.
Share your experiences and stories of chasing the ever-smaller and more elusive defects at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community. We invite you to submit your work for publication and to present to the industry in Pasadena, California, at the 48th year of ISTFA.
Each year, scientists from around the world congregate to discover new ideas, share their research, and experience the best the field has to offer. Attend so you can: present research, network with scientists, attend session and events, and browse the exhibit hall.
Join the nearly half a million neuroscientists from around the world who have propelled their careers by presenting an abstract at an SfN annual meeting — the premier global neuroscience event.
The 2022 MRS Fall Meeting will be held November 27 through December 2, 2022, in Boston, Massachusetts, at the Hynes Convention Center and adjacent Sheraton Boston Hotel. The world’s foremost international scientific gathering for materials research, the MRS meeting showcases leading interdisciplinary research in both fundamental and applied areas presented by scientists from around the world.