XEI Scientific, Inc.
RF Plasma Cleaning Systems for Electron Microscopes
and High Vacuum Systems

The EVACTRON® Anti-Contaminator and De-Contaminator
Stops Artifacts and Removes Hydrocarbons and Organics.

Updated August 2007

How Evactron® RF Plasma Cleans
SEMS, FIBS and fine film substrates:

Evactron® RF plasma creates oxygen radicals that sweep hydrocarbons, organics, and surface carbon from Electron Microscopes and fine vacuum coating systems. Atmospheric contaminants get swept through the roughing pump. After cleaning, turn off the Evactron® RF plasma and you get great SEM photos and cleaner substrates for fine vacuum coatings.

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  • Quickly remove hydrocarbon deposits from chamber walls and samples
  • Clean samples inside the SEM
  • Fast - cleans in minutes, not months
  • Activated Oxygen cleaning action. Low power RF plasma radical source
  • Compact - mounts externally on chamber
  • Uses air as oxygen source
  • Optional N2 purging capability
  • Safe - No sputter etching
  • Ideal for Materials Science and Metrology
  • Patented US 6,105,589, US 6,452,315, and US 6,610,257

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The EVACTRON®  system quickly cleans the interiors of electron microscopes including the stages, and specimens. It is an Anti-Contamination or Decontaminator accessory for electron microscopes and is used for hydrocarbon and organic contamination control in vacuum systems. It is used for black square and raster burn control, stopping oil condensation and drip from X-ray windows, plasma cleaning of high vacuum systems. It can do remote glow discharge cleaning, and hydrocarbon removal in vacuum chambers. The Evactron Decontaminator is a SEM Anti-contaminator or SEM Anticontaminator for RF Plasma cleaning and RF Plasma Ashing of vacuum chambers, AMC (Atmospheric Molecular Contamination) removal, or organic contamination control and removal in any high vacuum system. It removes Organics as an decontaminator.

Evactron® anticontamination system is for SEM and FIBs, EDX and EDS window cleaning. An RF Plasma Asher in Electron Microscopes that uses a low-power, air-plasma inside the specimen chamber to create oxygen radicals, all surfaces are reactively cleaned of hydrocarbons and residual oils in-situ. This prevents the coating of scanned areas with hydrocarbon polymer by the electron beam during SEM focusing or analytical work (no black squares or raster lines). It is designed for use microscope technicians with only simple training. Specimen cleaning by Evactron plasma oxidation may be done inside the specimen chamber either before or after examination by the electron beam. In addition to plasma oxidation, the system allows for SEM-CLEAN nitrogen purge cleaning of the SEM chamber and vacuum system when the plasma is not on.


EVACTRON System on SEM

This cleaning process takes place while the SEM chamber is at 0.6 Torr in rough pumping mode and is of a short duration. (2 - 10 minutes). The plasma cleaning is activated by operator command when needed. When activated the SEM is vented first to partial vacuum and then evacuation recommenced. At the correct pressure air is bled into the plasma source and then the RF plasma is ignited to create activated oxygen radicals for cleaning. After short time the plasma and air leak are turned off and the system is pumped down to remove the residual oxidation products. The SEM is soon ready for operation.

The feed gas to the plasma is air that is fed into the chamber through the exclusive XEI designed, low-power, RF plasma generator which maximizes oxygen radical output from air. Air is used because it is always available, and will not create the explosive conditions in oil sealed vacuum pumps that pure oxygen could. Argon is not used because it may accumulate and flood the ion pumps used in many SEMs on their electron guns.

EVACTRON Oxygen Radical Source on SEM port

A Nitrogen purge may be used to complete the cleaning and removes water vapor from the chamber. The Nitrogen purge function may be operated separately from the plasma function to suppress backstreaming from the roughing pumps.

Oxygen radicals are highly reactive to surface hydrocarbon scum or AMC (Atmospheric Molecular Contamination). The volatile reaction products of H2O, CO2, and CO are easily pumped away by the vacuum system. The plasma is confined to the generator region to minimize the bombardment of surfaces by free electrons or energetic ions that could cause sputtering or polymerization of the surface hydrocarbons or damage to sensitive SEM parts. The low power of the plasma and its confinement prevents ion etching and damage to detector windows and other sensitive surfaces within the SEM chamber. The system consists of a non-sputtering, glow discharge generator with a gas and power feed-through on a microscope port, RF Generator and matching network, vacuum gauging and control electronics.