DSS1
For Cleaning Larger Chambers

NEW Dry Plasma DSS1 .pdf


XEI Scientific, Inc in association with Dry Plasma Systems, Inc. introduces new products to complement the DSS1 - 100 Plasma Source and Control Unit for cleaning of larger chambers.

Dry Plasma Systems, Inc. designs and builds a line of "Downstream" plasma barrels and sources. They are used to remove organic and inorganic films in addition to treating the surface of various materials and substrates.

Dry Plasma's DSS1 has more power and is able to clean a larger chamber. It has a larger oxygen radical source; with a quartz tube inside where plasma is produced by an inductively coupled process.

  • Advanced Dry Plasma Etching with Oxygen and Nitrogen Gas Mixtures

  • DSS1's patented "constricted plasma" maximizes the generation of reactive neutrals for faster cleaning.

  • Two valved gas flow lines up to 200 sccm gas flows

  • A 13.56Mhz RF generator for the DSS1 source with up to 100 watts of power

  • One cycle timer to automatically turn off the RF power and the gas

  • Physical size of plasma source: 4"w, 6"h, 8.75" deep (+1" for gas fitting)